发明名称 |
PROCESS FOR JOINING MATERIALS USING A METALLIC HEAT SOURCE WITHIN A CONTROLLED ATMOSPHERE |
摘要 |
This invention is directed to a process for joining materials (20,40) comprising providing an assembly comprising at least one material layer; at least one metal heat source (30); and at least one solder layer (25 or 35), each solder layer disposed between each metallic heat source and each material layer; placing the assembly in a controlled atmosphere (50); and initiating a chemical reaction in the metal heat source so as to enable the solder to join the material layer.
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申请公布号 |
WO2008013806(A3) |
申请公布日期 |
2008.10.16 |
申请号 |
WO2007US16636 |
申请日期 |
2007.07.24 |
申请人 |
LINDE, INC.;SAXENA, NEERAJ;MCKEIGUE, KEVIN |
发明人 |
SAXENA, NEERAJ;MCKEIGUE, KEVIN |
分类号 |
B23K31/02 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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