发明名称 |
Molding apparatus, molded semiconductor package using multi-layered film, fabricating and molding method for fabricating the same |
摘要 |
Example embodiments include molding apparatuses, semiconductor packages, a fabricating methods for fabricating the same. The molding apparatus may include a first mold die for adhering a partially completed package, a second mold die including a cavity formed such that the partially completed package is positioned inside the cavity and a molding resin for encapsulating the partially completed package inserted into the cavity, and a multi-layered film supply unit for supplying a multi-layered film to the cavity of the second mold die. The semiconductor package may include a substrate, a semiconductor chip electrically connected to the substrate, a molding resin for encapsulating the semiconductor chip and an electrical portion of the substrate, and a marking film, adhered to an outer surface of the molding resin such that a mark is marked in the marking film.
|
申请公布号 |
US2008251949(A1) |
申请公布日期 |
2008.10.16 |
申请号 |
US20080078801 |
申请日期 |
2008.04.04 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SIN WHA-SU;KIM HEUI-SEOG;JEON JONG-KEUN |
分类号 |
H01L21/56;H01L21/67;H01L23/28 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|