| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a metal terminal in which a plating structure controlling surface roughness is improved, so as to improve bonding strength with a bonding wire, and further capable of realizing the simplification of a production process. <P>SOLUTION: Disclosed is a metal terminal 115 arranged on the surface of a wiring board and whose exposed face is welded to a bonding wire, composed of a copper base metal Bmb composed with a copper element as a base and a copper plating layer L stacked on the copper base metal composed with a copper element as a base, and whose condition is controlled, so as to be a surface roughness of ≤0.2 μm. <P>COPYRIGHT: (C)2009,JPO&INPIT |
