| 摘要 |
<p>PURPOSE:To obtain the multilayer wiring substrate having the large strength of connection between a large number of connecting pins and a substrate and high density by strongly studding the pins to the substrate and connecting the pins to a conductor pad formed to the back of a multilayer wiring board. CONSTITUTION:Connecting pins 33 are studded to a substrate 36 in latticed form, and the pins are penetrated the substrate and slightly projected to the back. The conductor pads 37 are shaped to the lower surface of a multilayer wiring board 30 in latticed form, are positioned at locations corresponding to the pins 36, and can be connected to the pins. The wiring board 30 is shaped by integrally stacking insulating layers 32, electronic parts are placed, and the board can be connected 35 to conductor layers 31. The wiring board 30 and the substrate 36 are stacked, the pads 37 and the pins 33 are connected by solder 38, and the titled substrate is completed.</p> |
