| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method by which a wiring board that has no core substrate and is formed by alternately laminating dielectric layers composed of a polymer material and conductor layers upon another can be manufactured easily, and to provide a wiring board obtained by the same. <P>SOLUTION: The method of manufacturing the wiring board includes: forming a laminated sheet body 10 on a main surface of a base dielectric layer 21 formed on a supporting substrate 20 for reinforcement at the time of manufacture; removing the peripheral section out of the laminated sheet body 10 while considering a region on the metal foil body 5 as a wiring laminating section 100 that must become a wiring board; and peeling the laminated sheet body 10 on the interface between the metal foil 5a and 5b with the other metal foil 5b adhered to the laminated sheet body 10, wherein the laminated sheet body 10 includes: a closely-adhered metal foil body 5 configured by closely adhering two pieces of metal foil 5a and 5b; a first dielectric sheet 11 sealing the metal foil body 5 while closely adhering to the base dielectric layer 21 in a circumferential region 21c of the metal leaf sticking body 5; a first conductor layer 31; and via conductors 41 formed by penetrating through the first dielectric sheet 11. <P>COPYRIGHT: (C)2009,JPO&INPIT |
