发明名称 SLUDGE TREATING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To effectively use a used chip type electronic part packing material treated as waste, and to dispose sludge having a high moisture percentage, difficult in handling and inferior in combustion efficiency still in its state. <P>SOLUTION: This sludge disposing method is provided for burning by mixing the used chip type electronic part packing material with the sludge including moisture by 80 mass% or more. The used chip type electronic part packing material desirably includes a paper chip type electronic part packing material by 30 mass% or more. The used chip part packing material is a used carrier tape crushed in a size of 1 mm to 10 mm, and is burnt at 800°C to 1100°C. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008241178(A) 申请公布日期 2008.10.09
申请号 JP20070083810 申请日期 2007.03.28
申请人 OJI PAPER CO LTD 发明人 SUENAGA HIROSHI;OKUYA TAKEHITO
分类号 F23G7/04;B09B3/00;C02F11/06;F23G5/02;F23G7/00 主分类号 F23G7/04
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