| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold clamping device which can protect the wiring of an ejector arranged in a rod and miniaturize the whole device. SOLUTION: In the mold clamping device 100 equipped with the rod 139 which transmits mold clamping force generated by an electromagnet unit 137 to a movable platen 112, the rod 139 is hollow with the driving part 201 of the ejector 200 and the wiring units 250 and 251 of the driving part 201 set in the hollow part of the rod 139. COPYRIGHT: (C)2009,JPO&INPIT
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