| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for producing a printed wiring board with the quality deterioration due to moisture absorption of a resin film (layer) in a half-cured state dramatically reduced, a copper foil with a resin, and the like. SOLUTION: The resin composition containing an A component (one or two or more kinds selected from the group consisting of a bisphenol A epoxy resin, which is liquid at 25°C of a 200 or less epoxy equivalent, a bisphenol F epoxy resin and a bisphenol AD epoxy resin), a B component (a linear polymer having a cross-linkable functional group), a C component (a cross-linking agent), a D component (an imidazol epoxy resin curing agent), and an E component (a brominized epoxy resin) includes bromine atoms in a range of 12 wt.%-18 wt.% with respect to 100 wt.% of the resin composition weight. Also provided is a copper foil with a resin having a resin layer formed with the resin composition, and the like. COPYRIGHT: (C)2009,JPO&INPIT |
