| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an aluminum base heat dissipation substrate for electric circuits which has high reliability by improving the adhesive strength between an alumite insulation layer and a metal film up to the same level as or higher level than that of the conventional printed wiring board. SOLUTION: The surface of an aluminum base is roughened with a chlorine-based roughening agent and then is anode-oxidized. After anode oxidation, the insulation film formed on the aluminum base should have a thickness of 5 to 100μm and a surface roughness of 3-15μm in Rz. Then, on the surface of the aluminum base, a metal seed layer is formed by sputtering method or evaporation method. Thereafter, a metal film is formed by electroplating method in a thickness being two or more times larger than the surface roughness Rz of the insulation layer. COPYRIGHT: (C)2009,JPO&INPIT |
