| 摘要 |
PROBLEM TO BE SOLVED: To provide an interlayer connection bonding sheet which has extremely high interlayer adhesive reliability and interlayer connection reliability and is capable of forming a high-density high-multilayer wiring board. SOLUTION: The interlayer connection bonding sheet (100a) for a multilayer wiring board is formed by laminating an adhesion layer (20a) containing alkenylphenol, maleimides, and an inorganic filler on at least one side surface of an insulating base (10) composed of a resin composite. COPYRIGHT: (C)2009,JPO&INPIT |
