发明名称 RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin-sealed power module having an excessive current cutoff function of absolutely cutting off excessive current when the excessive current flows as a result of the short circuit of a power semiconductor element. <P>SOLUTION: The resin-sealed semiconductor device includes a semiconductor element, a connection means connecting the semiconductor element electrically to an external terminal, and a sealing resin which is formed to seal therein the semiconductor element and connection means and is provided with an opening. Part of the connection means is exposed out of the resin sealing resin in the opening. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008235502(A) 申请公布日期 2008.10.02
申请号 JP20070071863 申请日期 2007.03.20
申请人 MITSUBISHI ELECTRIC CORP 发明人 NAKAJIMA YASUSHI;INAGUCHI TAKASHI;HAYASHI TATSUYA;KIMOTO NOBUYOSHI
分类号 H01L23/58;H01L21/60;H01L23/28 主分类号 H01L23/58
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