SEMICONDUCTOR PACKAGE WITH JUDGMENT DUMMY PATTERN FOR JUDGING ADHESION OF COPPER FOIL AND IMPLEMENTATION METHOD THEREOF

摘要

A semiconductor package circuit substrate having a measurement dummy copper foil pattern for evaluating adhesion of a copper foil and a method for implementing the same are provided to improve the reliability of adhesion evaluation data with a minimum cost. A base film(110) is made of an insulating material. An input wire(130) prepares a space for mounting a semiconductor chip on the base film and is configured to apply a driving signal being processed in the outside to a semiconductor chip(120). An output wire(140) is formed on the base film to output the driving signal processed in the semiconductor chip. A measurement dummy copper foil pattern is formed on the base film into a certain shape in order to evaluate adhesion of a conductive wire circuit. The measurement dummy copper foil pattern is a copper foil pattern that is made of a wire pattern comprised of a plurality of copper foils having different wire widths being successively arranged and connected to form one unity.