| 摘要 |
A portable object connectable package 1, 11, 21, 31, 41, 51, 61, 71, 81 for an electronic device comprises: -a semiconductor die package 2, 12, 22, 32, 42, 52, 62, 72, 82 comprising a top surface 2 A, 12 A, 22 A, 32 A, 42 A, 52 A, 62 A, 72 A, 82 A and an opposite bottom surface 2 B, 12 B, 22 B, 32 B, 42 B, 52 B, 62 B, 72 B, 82 B, the bottom surface comprising a plurality of connection elements 3 A, 13 A, 23 A, 33 A, 43 A, 53 A, 63 A, 73 A, 83 A for connecting to a printed circuit board PCB, and-a connector body 4, 14, 24, 34, 44, 54, 64, 74, 84 mechanically supported by the semiconductor die package and comprising a plurality of resilient electrical connecting elements extending over the top surface for contacting with a portable object PO, said circuit comprising a contacting area PO 1 . The portable object connectable package is arranged to be coupled to a portable object positioner ( 5 ) for removably positioning the contacting area (PO 1 ) of the portable object (PO) in contact with the plurality of resilient electrical connecting elements ( 4 ) when the portable object is present in the portable object positioner.
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