| 摘要 |
A light emitting device having a stack of layers bonded to an undoped substrate with a doped layer between the stack of layers and the undoped substrate. The stack of layers include a layer of first conductivity type over the doped layer, an overlying light emitting layer and a layer of second conductivity type. In one embodiment, the doped substrate is grown on a sacrificial substrate along with the remaining stack of layers prior to bonding to the undoped substrate. Electrical contacts are coupled to device on a side opposite the undoped substrate. In one embodiment, the layers of first conductivity, the light emitting layer, and the layer of second conductivity are removed to expose the doped layer and a first electrical contact is coupled to the layer of first conductivity through the doped substrate, while a second electrical contact is coupled to the layer of second conductivity.
|
