| 发明名称 |
SEMICONDUCTOR DIE ATTACHMENT FOR HIGH VACCUM TUBES |
| 摘要 |
There is described-novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom. |
| 申请公布号 |
EP1745506(A4) |
申请公布日期 |
2008.09.17 |
| 申请号 |
EP20050742093 |
申请日期 |
2005.05.02 |
| 申请人 |
INTEVAC, INC. |
发明人 |
COSTELLO, KENNETH, A.;RODERICK, KEVIN, J. |
| 分类号 |
H01L23/053;B23K5/00;B23K31/02;F15C1/06;H01J5/02;H01J31/26;H01L21/311;H01L21/60 |
主分类号 |
H01L23/053 |
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