CONDUCTOR PATTERN FORMING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method of forming conductor patterns that copes with a fine pitch of a semiconductor chip electrode.

SOLUTION: The conductor pattern forming method comprises the steps of forming a plurality of copper patterns 110 on one surface of a substrate 100; pressing a part of the copper patterns 110 from the thickness direction to thereby form partly wider regions 112 on the copper patterns 110; making solder powder adhere to each copper pattern 110; and melting the solder powder on the copper pattern for the formation of solder plating having bumps.

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