发明名称 APPARATUS FOR PLATING CONTINUOUS
摘要 A continuous plating apparatus is provided to solve a poor contact problem by installing supporting rollers on opposite parts of a plating object contacting with conduction rollers, and prevent components of the rollers from being eluted during the conduction by forming surfaces of the supporting rollers and conduction rollers from titanium. In a continuous plating apparatus for plating the plating object by supplying an electric current to the conduction rollers in a state that plating object contacts with lower and upper conduction rollers(10,20) while passing a plating object(1) through a plating solution by transfer rollers(2,2'), the continuous plating apparatus comprises supporting rollers(11,21) installed on opposite faces of the plating object contacting with the lower and upper conduction rollers to support the plating object correspondingly to the respective conduction rollers. The conduction rollers are made from titanium to prevent elution of metal components of the rollers caused by a reverse electric current during plating due to the supply of a PPR(Periodic Pulse Reserve) current. The conduction rollers comprise inner parts made from stainless steel and outer surfaces made from titanium.
申请公布号 KR20080079963(A) 申请公布日期 2008.09.02
申请号 KR20070020651 申请日期 2007.02.28
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 CHOI, WOO SUK
分类号 C25D17/00 主分类号 C25D17/00
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