MANUFACTURING APPARATUS AND MANUFACTURING METHOD FOR CIRCUIT BOARD, AND CUSHION SHEET USED FOR THE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To pressurize circuit board units uniformly to manufacture a circuit board having a sufficient bonding force easily and inexpensively.

SOLUTION: A manufacturing apparatus is used to stack a plurality of circuit board units each made up of a ceramic board and a metal plate in contact with each other via a waxing material or without the waxing material and to pressurize and bond together the circuit board units under a high temperature to manufacture a circuit board. The manufacturing apparatus includes a pressurizing means that pressurizes the circuit board units, and cushion sheets 21 interposed between at least some circuit board units. Each cushion sheet 21 is composed of carbon dense layers 23 formed on both surfaces of the cushion layer 22.

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