| 发明名称 |
Power semiconductor module |
| 摘要 |
<p>The power semiconductor module has a housing (12), where load connection elements (16) are arranged, which has contact devices (17). The housing forms an upper side material with a circular packing frame (22), and a cover (14) that is formed with an outer edge (24) that overlaps the circular packing frame.</p> |
| 申请公布号 |
EP1959494(A1) |
申请公布日期 |
2008.08.20 |
| 申请号 |
EP20080000987 |
申请日期 |
2008.01.19 |
| 申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG |
发明人 |
POPP, RAINER;LEDERER, MARCO |
| 分类号 |
H01L25/07 |
主分类号 |
H01L25/07 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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