PRINTED CIRCUIT BOARD HAVING ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THEREOF

摘要

A PCB(Printed Circuit Board) having an electronic component and a method for manufacturing the same are provided to implement the high density PCB by using a vertical embedding method and to maximize a degree of integration by utilizing both of up and down directions of a core. A method for manufacturing a PCB having an electronic component includes the steps of: preparing a first core substrate having a first electronic component with an electrode on one surface and a second core substrate having a second electronic component with an electrode on one surface(S10,S20); stacking the first and second core substrates while interposing an intermediate insulating layer(S30); forming a first via passing through the first and second core substrates(S40); forming a second via electrically connected to the electrode of the first electronic component through a first insulating layer(S50); and forming a lay-up layer on the first insulating layer(S60).