| 摘要 |
<p>A disk drive interposer may include a component board assembly, and an interconnect board. The component board assembly may have a plurality of electrical components electrically connected by a first set of electrically conductive traces. The interconnect board may have a first plurality of electrically-conductive pads disposed along a disk drive mating edge of the interconnect board and a second plurality of electrically-conductive pads disposed along a backplane mating edge of the interconnect board. The first plurality of pads may be electrically connected to the second plurality of pads by second set of electrically conductive traces. A mezzanine connector may electrically connect the first set of traces and the second set of traces. Such an interposer may physically and electrically mimic a disk drive from the frame of reference of a backplane, and physically and electrically mimic a backplane from the frame of reference of a disk drive.</p> |
