发明名称 RFID TAG PACKAGING SYSTEM
摘要 An electronic packaging system includes an electronic device and an array of surface elements surrounding the electronic device. A plurality of the surface elements of the array have a first height. The electronic device has a second height. The first height is greater than the second height so the array of surface elements protects the electronic device from loading.
申请公布号 WO2008005547(A3) 申请公布日期 2008.07.31
申请号 WO2007US15599 申请日期 2007.07.05
申请人 MICROSTRAIN, INC. 发明人 ARMS, STEVEN, W.;HAMEL, MICHAEL, J.
分类号 G08B13/14 主分类号 G08B13/14
代理机构 代理人
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