| 摘要 |
A circuit for selecting a chip in a multi chip package is provided to respectively select four chips from the multi chip package by employing a lead line unit comprised of one or more lead lines. First and second pads(231,232) receive a chip select signal. First and second switch units(S1,S2) are connected between the first and second pads to be contrarily operated in response to a pad select signal. A fuse displays the usage of the second pad to input the pad select signal. A lead line unit is comprised of one or more lead lines(210). The lead lines are bonded to the first and second pads to be connected to external signal lines. The second pad receives the chip select signal when the fuse is cut. When the fuse is not cut, the first switch unit is turned on and the second switch unit is turned off regardless of the pad select signal. The chip select signal is inputted into the chip through a first node where the first and second switches are connected.
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