Integrated circuit baring method for testing rupture of connecting wire, involves applying laser radiation and plasma on polymer envelope initially coating integrated circuit by laser source and plasma installing unit

摘要

The method involves applying a laser radiation by a laser source (28) e.g. excimer laser, and a plasma e.g. atmospheric plasma, by a plasma installing unit (46) on a polymer envelope initially coating an integrated circuit, where the plasma has carbon tetrafluorid and oxygen. The plasma is applied when the circuit is kept under the laser radiation, and the laser radiation is applied until thickness of a residual polymeric layer of the circuit is ranged between 50-200 micrometers. A gaseous flux is sprayed towards the circuit to clear residual particles from the circuit.