CONDUCTIVE PASTE WITH COPPER FILLER FOR EMI SHIELDING USE

摘要

A conductive copper paste composition for electromagnetic interference is provided to ensure good electroconductivity because copper powder is uniformly dispersed in a binder resin, and to retain the electroconductivity for a long time. A conductive copper paste composition for electromagnetic interference includes (a) a thermosetting binder resin, (b) an organic solvent, (c) a metal copper powder, and (d) a surfactant. The surfactant is a non-ionic surfactant, and is contained in an amount of 0.1-2.0 parts by weight based on 100 parts by weight of the metal copper powder. The thermosetting binder resin is polyurethane resin, and is contained in an amount of 15-20 parts by weight based on 100 parts by weight of the metal copper powder.