Halbleiteranordnung mit verbessertem Verbindungsmuster und Herstellungsverfahren dafür

摘要

A semiconductor device is described having an interconnection pattern comprising a dielectric layer (21) bonded to a metal layer (22) through an intermediate bonding layer (23) formed by reaction of an adhesion promoter with the metal. The dielectric layer comprises a material selected from the group consisting of teflons, parylenes and silesquioxanes. By employing a low resistivity metal, such as copper and a low dielectric constant material a low RC delay interconnection pattern can be formed.