| 摘要 |
A method of manufacturing an image sensor that may restrain the oxidization of a pad. A method of manufacturing an image sensor may include at least one of the following steps: Forming a photodiode structure including a pixel in an active region of a semiconductor substrate. Forming a conductive pad electrically connected the pixel in a peripheral region of the semiconductor substrate, where the peripheral region at least partially surrounds the active region. Forming a passivation layer with an opening exposing the pad on and/or over the photodiode structure. Covering the exposed pad with an etching prevention layer. Forming a color filter on and/or over the passivation layer corresponding to the pixel. Forming a microlens on and/or over the color filter. Removing the etching prevention layer from the pad.
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