发明名称 THERMAL MODULE MOUNTED ON CARRIER BY USING MAGNETIC FORCE
摘要 A thermal module includes a thermal conductor and at least one first magnetic element. The thermal conductor is disposed above a carrier. In addition, the thermal module may further include at least one second magnetic element or at least one magnetically susceptible element. Either the second magnetic element or the magnetically susceptible element and the first magnetic element can produce magnetic attractive force or magnetic repulsion force therebetween. By such magnetic force, the thermal conductor can be retained with respect to the carrier, thus making contact with a heat generating component.
申请公布号 US2008149321(A1) 申请公布日期 2008.06.26
申请号 US20070853030 申请日期 2007.09.11
申请人 COMPAL ELECTRONICS, INC. 发明人 TIEN CHI-WEI;WU CHANG-YUAN;SHIH CHANG-CHIANG;YEH LI-KAN;HSU I-FENG
分类号 F28F7/00 主分类号 F28F7/00
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