| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminate wherein a semiconductor device and a substrate are bonded to each other by a bonding agent layer, and the bonding agent layer is prevented from being formed over the central region of the semiconductor device, and to provide a manufacturing method of the laminate which can manufacture the laminate in a simple and effective way. <P>SOLUTION: In the laminate 1, a semiconductor device 2 and a substrate 3 are so constituted as to bond them to each other by a bonding agent layer 7, and each first electrode 5 provided in each outer peripheral edge of the semiconductor device 2 and each second electrode 6 provided in the substrate 3 are connected to each other. Also, the bonding agent layer 7 is so interposed between the semiconductor device 2 and the substrate 3 as to cover the first and second electrodes 5, 6 and is further disposed in the outer peripheral edges of the semiconductor device 2 so that it does not reach the central region of the semiconductor device 2; moreover, the bonding agent layer 7 is so disposed that it ranges over the more external regions than the outer peripheral ends of the semiconductor device 2; and furthermore, the bonding agent layer 7, present in farther exterior regions than the outer peripheral ends of the semiconductor device 2, includes particles 8 whose diameters are larger than the interval interposed between the semiconductor device 2 and the substrate 3. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
