| 摘要 |
Illumination devices ( 7 a) and ( 7 b) which irradiate light having a wavelength of 1.1 mum or less are arranged on a front surface and a rear surface of a cover ( 8 ) of a dicing device ( 1 ). After a wafer is placed on a dicing stage ( 3 ), when the wafer is diced by a blade ( 4 a) attached to a spindle ( 5 ), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices ( 7 a) and ( 7 b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle ( 5 ) or the like is not present on the wafer.
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