| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dynamic quantity sensor capable of preventing a beam part from being joined when joining a glass substrate to a semiconductor substrate, and capable of narrowing only a sensor gap to detect highly sensitively a dynamic quantity, and a manufacturing method for the dynamic quantity sensor, and electronic equipment provided with the dynamic quantity sensor. <P>SOLUTION: This dynamic quantity sensor 1 provided with the glass substrates 2, 3, and the semiconductor substrate 4 joined sandwichedly with the glass substrates 2, 3 and formed with a weight part 10 for detecting the dynamic quantity in its inside, is provided with a frame 9 for forming a sensor chamber 8 for storing the weight part 10, the beam part 11 having the sensor gaps 13, 14 between the respective glass substrates 2, 3 and the weight part 10, and for supporting the weight part 10 onto the frame 9, and an excitation electrode 20 and a detecting electrode 21 formed opposedly to the weight part 10 in the glass substrates 2, 3, Beam gaps 15, 16 between the beam part 11 and the respective glass substrates 2, 3 are set wider than the corresponding sensor gaps 13, 14. <P>COPYRIGHT: (C)2008,JPO&INPIT |
