| 摘要 |
A method of detecting the presence of particulate matter on a wafer chuck during semiconductor wafer processing involves providing data which is related to a positional perturbation of a semiconductor wafer which is present during the processing of the wafer, providing a threshold which is based on historical statistics obtained from the prior processing of wafers, and comparing the data to the threshold to determine if a predetermined condition is violated, which corresponds to the presence of particulate matter on the chuck.
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