发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To accurately form a transistor having desired characteristics. SOLUTION: When a silicon nitride film is to be used as an offset spacer for forming an extension region of the transistor, an oxide protective surface is formed by oxygen plasma treatment on a surface of the silicon nitride film prior to a step of removing a resist film. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008117848(A) 申请公布日期 2008.05.22
申请号 JP20060297774 申请日期 2006.11.01
申请人 NEC ELECTRONICS CORP 发明人 WATANABE TAKASHI
分类号 H01L21/8238;H01L21/318;H01L21/336;H01L27/092;H01L29/78 主分类号 H01L21/8238
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