发明名称 HEAT SINK FOR AN ELECTRONIC HOUSING
摘要 #CMT# #/CMT# Production of a cooling body with cooling fins, for an electronics housing, involves (a) preparing extruded profiled slabs (13) with mutually parallel cooling fins, (b) mutually orienting the slabs to give a surface with parallel cooling fins and (c) cutting the slabs to length, using a profiled circular saw (14) with a stepped profile, to give the cooling bodies. #CMT#USE : #/CMT# The cooling bodies are especially useful for electronics housings in the automobile sector. They are specifically of aluminum (claimed). #CMT#ADVANTAGE : #/CMT# The cooling bodies have good heat transfer properties; typically cooling bodies produced from extruded aluminum by the present method have ca. 30% higher thermal conductivity than those produced from aluminum by pressure casting. They can be produced inexpensively on a large scale in a wide range of 3-dimensional shapes and sizes, and are readily sealable with electronics housings. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The figure shows a sectioned view of a profiled circular saw while sawing through a profiled slab. 13 : Profiled slab 14 : Profiled circular saw 15 : Central milling blade 16 : Side milling blades 17 : Peripheral profiling #CMT#METALLURGY : #/CMT# Preferred Process: The profiled slabs (13) have flange-like profiling located parallel to the cooling fins, and are preferably extruded (specifically from aluminum) with varying number of cooling fins and/or varying geometries (as regards length, width and depth of profiling). The profiles are optionally cut into cooling bodies of different lengths. Cutting of the profiles is optionally carried out with circular saws of variable blade configurations. The cutting to length and profiling stages are optionally carried out in a one operating step.
申请公布号 EP1922177(A1) 申请公布日期 2008.05.21
申请号 EP20060777993 申请日期 2006.07.26
申请人 CONTINENTAL AUTOMOTIVE GMBH 发明人 SMIRRA, KARL;PFEUFFER, VIKTOR;ZICH, ROBIN
分类号 B23P13/04;B23P15/26;F28F3/04;H01L21/48;H01L23/367 主分类号 B23P13/04
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