| 摘要 |
A stacked semiconductor package and a method for manufacturing the same are provided to prevent occurrence of short-circuit between adjacent bumps by reducing electric connection length between a plurality of semiconductor chips and a base substrate. A stacked semiconductor package includes a base substrate(100), a first semiconductor chip(200), a second semiconductor chip(300), second bump balls, and a sealing portion(400). The base substrate includes an external connection terminal. First bonding pads and second bonding pads are arranged in an upper surface of the base substrate to be electrically connected to the external connection terminal. The first semiconductor chip is arranged in the upper surface of the base substrate. The semiconductor chip includes first bump balls connected to the first bonding pads. The second semiconductor chip is stacked on an upper portion of the first semiconductor chip. The second bump balls electrically connect bump pads and the second bonding pads to each other. The sealing portion wraps and protects the upper surface of the base substrate including the first and second semiconductor chips, and the second bump balls. |
