发明名称 PROCESSING EQUIPMENT, AND MANUFACTURING DEVICE OF WIRING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide processing equipment capable of reducing the floating surface area of local exhaust device, and to provide a manufacturing device of a wiring substrate provided with the processing equipment. SOLUTION: For the configuration of the processing equipment, the local exhaust device 4 can relatively surface from a support base 2 by the injection of a gas for surfacing to the support base 2, and the gas for surfacing is injected through a restrictor ventilation means 13 provided inside the local exhaust device 4. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008112958(A) 申请公布日期 2008.05.15
申请号 JP20070027056 申请日期 2007.02.06
申请人 SONY CORP 发明人 KAWABE HIDEO;KOSHIISHI AKIRA
分类号 H01L21/3205;C23C16/48;H01L23/52 主分类号 H01L21/3205
代理机构 代理人
主权项
地址