发明名称 |
Method of fabricating a stacked die having a recess in a die BGA package |
摘要 |
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
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申请公布号 |
US7371608(B2) |
申请公布日期 |
2008.05.13 |
申请号 |
US20030389433 |
申请日期 |
2003.03.14 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
TAN HOCK CHUAN;LIM THIAM CHYE;TAN VICTOR CHER KHNG;NEO CHEE PENG;TAN MICHAEL KIAN SHING;CHEW BENG CHYE;POUR CHENG POH |
分类号 |
H01L21/48;H01L23/31;H01L23/48;H01L23/498;H01L25/065;H01L29/06 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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