CAPACITOR EMBEDDED PRINTED CIRCUIT BORAD AND MANUFACTURING METHOD OF THE SAME

摘要

A capacitor embedded PCB(Printed Circuit Board) and a manufacturing method thereof are provided to maintain an electrical characteristic of a capacitor by forming a top electrode of the capacitor with a metal film and a conductive paste layer as a thick film. A manufacturing method of a capacitor embedded PCB includes the steps of: preparing a laminate including a laminated plate with first and second copper foils(12a,12b) on both surfaces and at least one bottom electrode on at least one surface; forming a dielectric film(13) on at least one bottom electrode; forming a metal film(14a) on a region of a top surface of the dielectric film, where a capacitor is to be formed, by using a thin film deposition process; forming a conductive paste layer(14b) of a top electrode on at least a region of a top surface of the metal film; forming insulating resin layers(11) on both surfaces of the laminated plate respectively; and forming conductive via holes(16b) on the insulating resin layers to be connected to the conductive paste layer of the top electrode.