发明名称 PHOTOSENSITIVE COMPOSITION, COMPOUND FOR USE IN PHOTOSENSITIVE COMPOSITION, AND PATTERN-FORMING METHOD USING PHOTOSENSITIVE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive composition which is used in a process for producing a semiconductor such as IC, a process for producing a circuit board such as a liquid crystal or a thermal head, a process for photofabrication, or the like, and is excellent in sensitivity, resolution, roughness, pattern shape and out gas characteristics, to provide a compound using the composition, and to provide a method for forming a pattern with the photosensitive composition, to provide a compound for use in the photosensitive composition, and to provide a pattern-forming method using the photosensitive composition. <P>SOLUTION: A new compound (A) represented by the general formula (I) (R<SP>1</SP>to R<SP>13</SP>are each independently H or a substituent; Z is a single bond or a divalent linking group; X<SP>-</SP>is an anion containing a proton acceptor functional group), a photosensitive composition containing the same, and a pattern-forming method using the photosensitive composition. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008100988(A) 申请公布日期 2008.05.01
申请号 JP20070239577 申请日期 2007.09.14
申请人 FUJIFILM CORP 发明人 KAWANISHI YASUHIRO;WADA KENJI
分类号 C07D333/76;C07D339/08;G03F7/004;G03F7/038;G03F7/039;H01L21/027 主分类号 C07D333/76
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