METHOD OF INSPECTING AN IDENTIFICATION MARK, METHOD OF INSPECTING A WAFER AND APPARATUS FOR INSPECTING A WAFER

摘要

An identification mark inspecting method is provided to almost avoid generation of an additional time interval by inspecting a defect of an identification mark formation region while using an image obtained for inspecting whether an identification mark is read. The image of an identification mark formed on a wafer is obtained(S110). The identification mark is read by using the image of the identification mark(S120). When the identification mark is read, a region where the identification mark is formed is inspected by using the image of the identification mark(S130). Whether the identification mark is read is determined according as the identification marks of the image are compared with predetermined reference identification marks and every reference identification mark match one of the reference identification marks.