发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device for raising a withstand voltage in an element terminal end region and raising the withstand voltage as a whole element, and to provide its manufacturing method. SOLUTION: The semiconductor device, which has an element region for forming a semiconductor element and a terminal end region for enclosing the element region, includes: an n++ type layer 1; an n+ type layer 2 formed on the n++ type layer 1 in the element region, where an impurity concentration is not more than that of n++ type layer 1; and an n type drift layer 3 formed on the n+ type layer 2 in the element region and on the n++ type layer 1 in the terminal end region. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008078282(A) 申请公布日期 2008.04.03
申请号 JP20060254157 申请日期 2006.09.20
申请人 TOSHIBA CORP 发明人 IZUMISAWA MASARU;TAKASHITA MASAKATSU;SUMI YASUTO;OTA HIROSHI;SAITO WATARU;ONO SHOTARO
分类号 H01L29/78;H01L21/336;H01L27/04;H01L29/06 主分类号 H01L29/78
代理机构 代理人
主权项
地址