| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a semiconductor device manufacturing method that enables miniaturization of a device by reducing the size of a stage. <P>SOLUTION: A semiconductor device is provided with the stage 31 on which a wafer 10 is mounted, a cover 54 which covers the stage 31 and has an opening part 53, and a bonding head 32 that bonds a chip 20 onto the wafer 10 through the opening part 53 in the cover 54. The cover 54 is rotated with respect to the stage 31 so as to align the opening part 53 to the desired position of the wafer 10. <P>COPYRIGHT: (C)2008,JPO&INPIT |
