LIGHT EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

A light emitting diode package and a manufacturing method thereof are provided to firmly attach a lens to a package body by enlarging an attaching area between the lens and the package body. A light emitting diode(2) is formed on a package body(1), and a lens(4) is attached to an upper portion of the light emitting diode. At least one air venting groove(5) is formed on a predetermined region of the package body so as to discharge air between the light emitting diode and the lens. The air venting groove is positioned under a periphery of the lens. The air venting groove is formed in such a way that an upper area of the air venting groove is smaller than a lower area. The lens is attached to the upper portion of the light diode by using a transparent adhesive.