| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated ceramic electronic component which can polish a green chip at a low cost and prevent excess chamfering to the green chip, and can consequently prevent defect of electrical characteristics in an obtained electronic component. SOLUTION: The method of manufacturing the laminated ceramic electronic component has a step of forming a green sheet 10a, a step of forming an inner electrode layer 12a, a step of forming a lamination body 16 with a chip region 40 and a dummy region 42 by laminating a plurality of green sheets 10a and inner electrode layers 12a, a step of forming a green chip 44 with the inner electrode layer 12a from the chip region 40 by cutting the laminate 16 to a prescribed size and forming a dummy chip 46 without the inner electrode layer 12a from the dummy region 42 simultaneously and a first polishing step of polishing the green chip 44 by using the dummy chip 46. COPYRIGHT: (C)2008,JPO&INPIT
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