SYSTEM WITH DUAL LASER FOR SEPARATION OF BONDED WAFERS, EACH LASER EMITTING A LASER BEAM WITH A PREDETERMINED WAVELENGTH

摘要

The present invention relates to a system (100) for dicing a bonded wafer (110) including a plurality of substrates having at least a first substrate (120) bonded to at least a second substrate (130). A first laser (140) is configured to emit a first laser beam (240a) at a first predetermined wavelength such that the first laser beam (240a) creates a modified layer (250) within the first substrate (120) and is transparent to the second substrate (130). A second laser (150) is configured to emit a second laser beam at a second predetermined wavelength such that the second laser beam heats an inner portion of the second substrate (130) creating a stress plane therein and is transparent to the first substrate (120).