| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of preventing chipping of a cutting part at dividing. SOLUTION: The manufacturing method includes a process to prepare a semiconductor wafer 101A comprising an upper surface (first surface) on which a plurality of element regions and division regions divide a plurality of element regions, and a rear surface (second surface) on the opposite side of the upper surface (first surface), a process in which an upper layer wiring 102 is formed in each element region on the upper surface (first surface), a process in which a through hole A2 that exposes the upper layer wiring 102 is formed by etching using Deep-RIE, for example, a semiconductor wafer 101A from the rear surface (second surface) side, and a groove B2 is formed in the region of the rear surface (second surface) that corresponds to a division region on the upper surface (fist surface), and a process for dividing the semiconductor wafer 101A into each element region. COPYRIGHT: (C)2008,JPO&INPIT |
