发明名称 APPARATUS FOR MOUNTING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To suppress temporary failures in a carrying operation caused by accidental factors such as the variation of the contour size of a substrate or the variation of dimensions of the respective parts of a carrier and its operations. <P>SOLUTION: The apparatus for mounting electronic component is provided with a sensor for detecting the operation state of at least either carry-in or carry-out. In a step 306, whether the detected operating state continues without changing for a fixed time or longer is determined by a monitoring timer. When it is determined it is continued, it is determined that the operating state is abnormal, a restoring operation of canceling the operating state is performed in a step 326; and then an operation, when it has been determined to be abnormal, is performed again in a step 328. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008066621(A) 申请公布日期 2008.03.21
申请号 JP20060245185 申请日期 2006.09.11
申请人 JUKI CORP 发明人 TSUNEKAWA YUKI
分类号 H05K13/02 主分类号 H05K13/02
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