METHOD OF FABRICATING A PRINTED CIRCUIT BOARD HAVING A FINE LINE SPACING PITCH

摘要

A method for fabricating a printed circuit board having a fine line spacing pitch is provided to maintain a thin copper foil of a copper foil circuit by coating only an inner wall of a via hole or a through-hole with copper. A method for fabricating a printed circuit board(100) includes the steps of: pattern-forming a plating resist on an outer layer copper foil surface so that only a via hole(10) and a through-hole(12) are exposed and the rest outer layer copper foil surface is not exposed; forming an interlayer conductive coating layer by forming a conformal copper plated layer on inner walls of the via hole and the through-hole by performing chemical plating and copper plating; delaminating the plating resist; polishing and removing the conformal plated layer projected on the outer layer copper foil surface by polishing a surface of the board by delaminating the plating resist; and forming a circuit pattern on the outer layer copper foil from which the conformal plated layer is surface-polished and removed.