EQUIPMENT FOR PACKAGE CUTTING AND METHOD OF PACKAGE CUTTING USING THE SAME EQUIPMENT
摘要
<p>Equipment for cutting a package is provided to reduce a time interval necessary for exchanging a chamfer bit and a router bit by separately performing a chamfer cutting process and a router cutting process while using three spindles. At least two spindles(300) cut a frame composed of a plurality of packages into unit packages by using a cutting bit(420), mounted on a sawing robot. The frame is loaded into a frame loading jig(700) so as to be cut. A frame picker(820) and a unit picker(840) load/unload the frame into/from the frame loading jig, mounted on a cartesian robot(200). The mounting state of the cutting bit on the spindle is checked by using a vision. The cutting bit can include a chamfer bit(422) and a router bit(424). The chamfer bit carries out a chamfer cutting process to tilt the section of the package. The router bit performs a router cutting process on the outer portion of the package including a curved portion except the chamfer-cut portion. Each spindle is mounted with the chamfer bit or router bit to perform the chamfer cutting process or router cutting process.</p>
申请公布号
KR20080021209(A)
申请公布日期
2008.03.07
申请号
KR20060082942
申请日期
2006.08.30
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
CHOI, TAI KEW;SUN, YONG KYUN;YANG, HEE SANG;EUM, YO SE;JANG, HO SOO