PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

A printed circuit board and a method for manufacturing the same are provided to make a substrate of a thin film by impregnating the PCB on a plane of an insulated material on an adhesive insulated layer, and forming the circuit on a rear plane of the adhesive insulated layer. A printed circuit board includes a first resin substrate(101), a second resin substrate, an insulation layer(105), a blind via-hole and a penetration hole(107), a third circuit pattern, a fourth pattern, and a metal layer(102). The first resin substrate has a first circuit pattern. The second resin substrate has a second circuit pattern. The insulation layer is stacked between the first resin substrate and the second resin substrate so that the first and second circuit patterns are arranged on an internal layer. The blind via-hole and penetration hole is formed on the first and second resin substrates and the insulation layer. The third and fourth circuit patterns are formed on the other plane of the first and second resin substrates. The metal layer is formed on the penetration hole. The first and second resin substrates have a dielectric constant of 1.5-4.0. The first to fourth circuit patterns and the metal layer are composed of a metal deposition seed layer formed by an ion beam surface process and a vacuum deposition, and a metal electrolyte plating layer formed by an electrolyte plating.